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ผู้ผลิตพื้นผิวแพ็คเกจ FCBGA

What is FCBGA Package Substrate? ผู้ผลิตพื้นผิวแพ็คเกจ FCBGA,FCBGA (Flip Chip Ball Grid Array) package substrate is an advanced semiconductor packaging solution designed for high-performance applications. This substrate features a grid of solder balls on its underside, enabling direct attachment of the semiconductor die using flip chip technology. FCBGA substrates offer superior electrical performance, reduced interconnect length, and efficient thermal…