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ผู้ผลิตพื้นผิวแพ็คเกจ SIP

What is SIP Package Substrate? ผู้ผลิตพื้นผิวแพ็คเกจ SIP,SIP (System-in-Package) package substrate is a versatile platform designed to integrate multiple semiconductor components into a single, compact module. This substrate supports the stacking and interconnection of various chips, such as processors, ความจำ, and passive components, enabling a highly integrated system. SIP substrates offer excellent electrical performance, การจัดการความร้อน, and mechanical stability,…