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Fabricante de substrato de pacote MIS

What is MIS Package Substrate? Fabricante de substrato de pacote MIS,MIS (Molded Interconnect Substrate) package substrate is a sophisticated solution for compact and high-performance electronic assemblies. This substrate integrates both circuitry and mechanical structures into a single molded component, reducing the need for additional layers and connectors. MIS substrates offer excellent electrical performance, mechanical stability, e gerenciamento térmico. They are commonly used…