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FCBGA Package Substrate manufacturer

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BT Package Substrate Manufacturer
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Rigid-Flex Package Substrate Manufacturer
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ABOUT US

SHENZHEN QYC CO.,LTD

We can produce 2 layers to 100 layers of high frequency/high speed HDI circuit board, we can also produce 2 layers to 20 layers of high frequency/high speed BGA package substrate, conventional high frequency/high speed circuit board delivery time is about 1 to 3 weeks. The delivery time of the high-frequency/high-speed BGA package substrate, for example: the delivery time of the 20-layer ultra-small trace (20um/20um) ABF FC BGA package substrate is about 3 months

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Glass Package Substrate Manufacturer

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Microtrace Substrate Manufacturer

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ABF(Ajinomoto) Package Substrate Manufacturer

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DIP Package Substrate Manufacturer

LCC Package Substrate Manufacturer

CONTACT US

Phone: +086 0755 85241496

E-mail: market@qycltd.com

Skype: Henrychinasz

WhatsAPP: +8615014077679

Address: Oriental Business Building, 182 Baomin 2nd Road, Xixiang Street, Baoan District, Shenzhen, Guangdong,China

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