FCBGA 패키지 기판 제조업체
GLOBAL FLIP CHIP PACKAGE SUBSTRATE
In the ever-evolving realm of electronics manufacturing, precision and reliability are paramount. SHENZHEN QYC CO., LTD is a professional producer of Flip Chip Package Substrates, boasting over 10,000 dedicated employees and state-of-the-art equipment sourced exclusively from Japan. We take pride in consistently delivering top-quality FC BGA substrates, with quality assurance serving as the cornerstone of our operations. The high-precision equipment we meticulously select from Japan forms the backbone of our commitment to providing best-in-class FC BGA substrates, resulting in a level of quality and stability that our customers can unequivocally trust.
Our production capabilities span a wide range of designs, from 4 받는 사람 20 layers of Flip Chip Package Substrates. Whether your project necessitates a compact design or a multi-layer solution, our expertise and infrastructure are tailored to meet your requirements. What sets us apart is our ability to work with exceptional precision, boasting a minimum line width and pitch of 9 micrometers each. Our production turnaround time typically ranges from 1 받는 사람 2 개월. Despite our rapid production pace, quality remains our primary focus. We firmly believe that quality cannot be compromised, even when faced with tight schedules. Thus, each project undergoes rigorous quality control and testing procedures to ensure that every Package Substrate produced exhibits exceptional performance and reliability. This swift delivery is seamlessly combined with an unwavering commitment to upholding the highest quality standards, ensuring a smooth and seamless progression of your project.
Material selection is crucial in the Package Substrate manufacturing process. We offer a wide variety of packaging substrate materials, with the majority sourced from Asia, including Japan, South Korea, Taiwan, and China. Recognizing the uniqueness of each project, we remain flexible in selecting and utilizing the most suitable materials based on our customers' needs, ensuring that the Package Substrates produced perfectly align with the specific requirements of the project.
Our goal is to provide excellent solutions, drive continuous development in the electronics industry, and create greater value for our customers. We eagerly anticipate the opportunity to collaborate with you and collectively achieve project success.
